Serving our customers with quality and safety first.
metal
0.260in. ⁓17/64"
1.500in.
0.370in. ⁓3/8"
TO-99
2 transistor
terminal
0.200in.
hermetically sealed case
silicon all transistor
70.0 collector to base voltage/static/emitter open all transistor and 6.0 emitter to base voltage, static, collector open all transistor and 60.0 collector to emitter voltage/static/base open all transistor
30.00 milliamperes source cutoff current all transistor
1.25 watts SMALL-Signal input power, COMMON-Collector preset all transistor
240.0 static forward current transfer ratio, COMMON-Emitter all transistor
200.0 deg celsius junction
all transistor junction pattern arrangement: npn
81349-MIL-PRF-19500 specification (includes engineering type bulletins, brochures, etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type data on certain environmental and performance requirements and test conditions that are shown as "typical", "average", "", etc.) .
6 uninsulated wire lead
81349-MIL-PRF-19500/355 government specification
Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.
Packing shall be accomplished in accordance with table c.ii for the packing level specified. closure, sealing and reinforcement shall be in accordance with applicable specification for shipping container.
Packing shall be accomplished in accordance with table c.ii for the packing level specified. closure, sealing and reinforcement shall be in accordance with the appropriate shipping container specification.
All packaging data is mandatory for compliance and no substitutions are permitted. fast packs should be included in this category.
Special requirements.
OPI: Optional Procedure Indicator Code. A one position alpha code that indicates the allowable deviations from the prescribed requirements.
SPI No.: Special packaging instructions number.
LVL A/B/C: Indicates the type of shipping container required for level A, B, or C maximum packing protection.
SPC Mkg: A two position code that identifies the special markings applied to the container, which is part of the total pack to protect the contained item during preservation, packing, storage, transit and removal from the pack.
Indicates there is no data in the hmirs and the nsn is in a fsc not generally suspected of containing hazardous materials.
Item does not contain precious metal.
Represents items with no adp components
The item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application.
HMIC: Hazardous Material Indicator Code. A one position code that identifies a hazardous item.
PMIC: Precious Metal Indicator Code. A one position code which identifies items that have precious metals as part of their content. precious metals are those metals generally considered to be uncommon, highly valuable, and relatively superior in certain properties such as resistance to corrosion and electrical conductivity.
ESD: Electrostatic Discharge. Indicates if an item is susceptible to electrostatic discharge or electromagnetic interference damage. electrostatic discharge damage occurs when an accumulation of static electricity generated by the relative motion or separation of materials is released to another item by direct contact. electromagnetic interference damage occurs when an item comes into proximity with an electrostatic or magnetic field.
ENAC: Enviromental Attribute Code. Identifies items with environmentally preferred characteristics.
CRITL: Criticality Indicator Code. Indicates an item is technically critical by tolerance, fit, application, nuclear hardness properties, or other characteristics.