Serving our customers with quality and safety first.
glass
0.785in. ⁓51/64"
0.260in.
0.200in.
0.310in.
8 semiconductor device diode
terminal
hermetically sealed case and quality assurance level txv
silicon all semiconductor device diode
75.0 breakdown voltage, dc all semiconductor device diode
200.00 milliamperes forward current, average absolute all semiconductor device diode
600.0 milliwatts SMALL-Signal input power, COMMON-Collector preset all semiconductor device diode
175.0 deg celsius ambient air
all semiconductor device diode junction pattern arrangement: pn
terminals external surface gold
gold
81349-MIL-S-19500 specification (includes engineering type bulletins, brochures, etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type data on certain environmental and performance requirements and test conditions that are shown as "typical", "average", "", etc.) .
16 pin
81349-MIL-S-19500/474 government specification
Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.
Packing shall be accomplished in accordance with table c.ii for the packing level specified. closure, sealing and reinforcement shall be in accordance with applicable specification for shipping container.
Packing shall be accomplished in accordance with table c.ii for the packing level specified. closure, sealing and reinforcement shall be in accordance with the appropriate shipping container specification.
Packing shall be accomplished to meet the performance test requirements of astm-d4169, distribution cycle 18, assurance level 3.
All packaging data is mandatory for compliance and no substitutions are permitted. fast packs should be included in this category.
Special requirements.
OPI: Optional Procedure Indicator Code. A one position alpha code that indicates the allowable deviations from the prescribed requirements.
SPI No.: Special packaging instructions number.
LVL A/B/C: Indicates the type of shipping container required for level A, B, or C maximum packing protection.
SPC Mkg: A two position code that identifies the special markings applied to the container, which is part of the total pack to protect the contained item during preservation, packing, storage, transit and removal from the pack.
Indicates there is no data in the hmirs and the nsn is in a fsc not generally suspected of containing hazardous materials.
Item contains gold.
Represents items with esd sensitivity.
The item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application.
HMIC: Hazardous Material Indicator Code. A one position code that identifies a hazardous item.
PMIC: Precious Metal Indicator Code. A one position code which identifies items that have precious metals as part of their content. precious metals are those metals generally considered to be uncommon, highly valuable, and relatively superior in certain properties such as resistance to corrosion and electrical conductivity.
ESD: Electrostatic Discharge. Indicates if an item is susceptible to electrostatic discharge or electromagnetic interference damage. electrostatic discharge damage occurs when an accumulation of static electricity generated by the relative motion or separation of materials is released to another item by direct contact. electromagnetic interference damage occurs when an item comes into proximity with an electrostatic or magnetic field.
ENAC: Enviromental Attribute Code. Identifies items with environmentally preferred characteristics.
CRITL: Criticality Indicator Code. Indicates an item is technically critical by tolerance, fit, application, nuclear hardness properties, or other characteristics.
Defense logistics agency, enterprise business systems
Electronic components (engineering support at the 88th ose/oss)
SOS: Source of Supply. A three position code or routing identifier code (ric), which identifies the source of supply activity.
SMIC: Special Material Indicator Code. A two position code, which categorizes material on the basis of requirements for source or quality control, technical design or configuration control, procurement, stocking and issue control, special receipt, inspection, testing, storage, or handling.
MMAC: Material Management Aggregation Code. A two position code that identifies an item of supply to be managed by a specific activity manager.
MCC: Material Echelon Code. A two position code employed by the marine corps in classifying items into categories by materiel category and procurement echelon. the alphanumeric management code is in the first position and identifies the materiel category
IMC: Denotes wether items shall be subjected to integrated management under the defense supply agency or retained by the individual military service or other department of defense components for their management. Assigned by th activity responsible for item management coding.