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Datasheet. ICA-316-SGG specification
The basic material of which the body is fabricated.
brass or phosphor bronze
Consists of plating,dip,and/or coating that cannot be wiped off. plating and/or coating is any chemical and/or metallic additive,electrochemical,or mild mechanical process which protects the contact surface.
gold
The number of contacts accommodated by the item.
16
The style designation indicating the configuration that most nearly corresponds to the arrangement of the contact positions.
dual IN-Line
Those unusual or unique characteristics or qualities of an item not covered in the other requirements and which are determined to be essential for identification.
side and end stackable; black glass filled; polyester insulator material; temp range -65 to +125 deg c
Answers.
Schedule B number: 8536695050
Electrical plugs & sockets, for a voltage not exceeding 1,000 v
FSC 5935 ⁓ Connectors, electrical
Excluding interconnectors, fiber optic
NSN 5935-01-367-3054 SOCKET,PLUG-IN ELECTRONIC COMPON
side
- NIIN
- 013673054
- NIIN Date
- 11/10/92
- Schedule B
- 8536695050
- Name Code
- 28914
- FIIG
- A02300
- DEMIL / ITAR
- Uncontrolled item (Code A)
- Hazmat
- No hazard information available from HMIRS.
- MSDS
- N/A
- Precious Metals
- Contains gold
- Enviromental
- N/A
- Electrostatic ESD & EMI
- No ESD or EMI sensitivity
Other Part Numbers Parts with same form, fit, and function by other manufacturers
Major End Users Countries and entities
- - National Aeronautics And Space Administration
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ICA-316-SGG / Socket,plug-in electronic componWhat is the formal definition of this item?
An item designed to electrically connect and mechanically position the base of an item having plug-in-type contacts, and to facilitate replacement of the item accommodated. it includes sockets which accommodate the contacts of capacitors, coils, crystals, electron tubes, relays, semiconductor devices and vibrators. excludes sockets or receptacles designed to accommodate plug-in component circuit boards (printed circuit boards) and electronic modules or sub-assemblies. also excludes heat-dissipating (not heat-sinks) sockets for mounting "power transistors".
