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chip type
established
0.0100
0.180in.
0.050in.
0.022in. and 0.055in.
no common or grounded electrode (s)
electronic component
12000.000 picofarads single section
-55.0 deg celsius and 125.0 deg celsius
50.0 dc single section
-20.0/+20.0 single section
agav
-10.00/+10.00 percent single section
ceramic or glass
termination finish is base METALLIZATION-Barrier METAL-Solder (min thick of 60 MICRO-Inches) tin/lead alloy
81349-MIL-C-55681 specification (includes engineering type bulletins, brochures, etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type data on certain environmental and performance requirements and test conditions that are shown as "typical", "average", "", etc.) .
2 bonding pad
1EA
Schedule B number: 8532290040
nmfc 061400
Fixed capacitors
FSC 5910 ⁓ Capacitors
Excluding semiconductor devices and associated hardware.
Used on electronic component. termination finish is base metallization-barrier metal-solder (min thick of 60 micro-inches) tin/lead alloy
1. | MIL-C-55681/1 | Cage 81349 |
Nothing similar to this part number was found in our inventory
A capacitor, whose capacitance value cannot be adjusted or varied, having a ceramic dielectric. it may be a single unit, or consist of two or more fixed units which cannot be separated.