RK73B1JTTD563J

RK73B1JTTD563J Film Fixed Chip Resistor

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Datasheet. RK73B1JTTD563J specification

Electrical Resistance
A measure of the opposition to the flow of electrical current.

56000.000 ohms

Inclosure Method
The means provided to coat,cover,or protect the item.

encapsulated

Power Dissipation Rating In Watts
The maximum amount of electrical energy that can be expended by an item,expressed in watts.

0.100 free air

Part Name Assigned By Controlling Agency
The name assigned to the item by the government agency or commercial organization controlling the design of the item.

thick film chip resistor

Answers.

What is the NSN for RK73B1JTTD563J?

5905-01-577-7464

How is this classified for shipping?

Schedule B number: 8533100042
Fixed carbon resistors, composition or film type, designed for surface mounting, having two terminals

What's the federal classification of RK73B1JTTD563J?

FSC 5905 ⁓ Resistors

Excluding resistance wire.

NSN 5905-01-577-7464 RESISTOR,CHIP,FIXED,FILM

thick film chip resistor

NIIN
015777464
NIIN Date
09/16/09
Schedule B
8533100042 
Name Code
67164
FIIG
A001A0
DEMIL / ITAR
Uncontrolled item (Code A)
Hazmat
No hazard information available from HMIRS.
MSDS
N/A
Precious Metals
No precious metals
Enviromental
N/A
Electrostatic ESD & EMI
No ESD or EMI sensitivity

Major End Users Countries and entities

  • - Republic of Korea 

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Similar by Design Other resistors with similar characteristics

Nothing similar to this part number was found in our inventory

RK73B1JTTD563J / Resistor,chip,fixed,filmWhat is the formal definition of this item?

A resistor whose ohmic value cannot be adjusted or varied. the resistor element consists of either a thin layer or conductive material, containing neither binders or insulating materials, deposited on an insulated form, or an alloy of metal and ceramic materials, usually fused to an insulated form. opposition to the flow of current is an inherent property of the materials used and is manifest by the heat dissipation in the resistor. primarily intended for incorporation into microelectronic circuits and surface mounted applications.