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Datasheet. MP930-2.00-1% specification
The name assigned to the item by the government agency or commercial organization controlling the design of the item.
MP900 series KOOL-Pac power film resistor
Those unusual or unique characteristics or qualities of an item not covered in the other requirements and which are determined to be essential for identification.
model MP930; package to 220 sytle; resistance min.0.020 ohms, max 4.99k; 30watts power rating (derating using CASETEMPERATURE-Tc) ; 250 max.voltage; thermal resistance film to case 4.17 degreescelsius/watt; max temp.150 degrees celsius; ceramic mounting surface
Answers.
Schedule B number: 8533100042
Fixed carbon resistors, composition or film type, designed for surface mounting, having two terminals
FSC 5905 ⁓ Resistors
Excluding resistance wire.
NSN 5905-01-559-7394 RESISTOR,CHIP,FIXED,FILM
model MP930; package to 220 sytle; resistance min.0.020 ohms, max 4.99k; 30watts power rating (derating using casetemperature-tc) ; 250 max.voltage; thermal resistance film to case 4.17 degreescelsius/watt; max temp.150 degrees celsius; ceramic mounting surface MP900 series kool-pac power film resistor
- NIIN
- 015597394
- NIIN Date
- 01/03/08
- Schedule B
- 8533100042
- Name Code
- 67164
- FIIG
- A001A0
- DEMIL / ITAR
- Uncontrolled item (Code A)
- Hazmat
- No hazard information available from HMIRS.
- MSDS
- N/A
- Precious Metals
- No precious metals
- Enviromental
- N/A
- Electrostatic ESD & EMI
- No ESD or EMI sensitivity
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MP930-2.00-1% / Resistor,chip,fixed,filmWhat is the formal definition of this item?
A resistor whose ohmic value cannot be adjusted or varied. the resistor element consists of either a thin layer or conductive material, containing neither binders or insulating materials, deposited on an insulated form, or an alloy of metal and ceramic materials, usually fused to an insulated form. opposition to the flow of current is an inherent property of the materials used and is manifest by the heat dissipation in the resistor. primarily intended for incorporation into microelectronic circuits and surface mounted applications.
